Linked Life Data

1290756

Source:http://linkedlifedata.com/resource/pubmed/id/1290756

Statements in which the resource exists as a subject.
PredicateObject
rdf:type
lifeskim:mentions
pubmed:issue
1
pubmed:dateCreated
1993-4-1
pubmed:abstractText
The purpose of this study was to investigate the influence of etching times and thermal cycling on resin adhesion on ground primary enamel. Two hundred bovine mandibular primary incisors were used. Materials used in this study were 40% phospholic acid gel, Photo Bond and Photo Clearfil A (Kuraray Co., Kurashiki, Japan) in PCA groups and 37% phospholic acid gel, Scotch Bond and Silux (3M Co., St. Paul, MN) in the Silux groups. The etching times were 0, 10, 20, 30 and 60 seconds. Shear bond strengths were tested. After the shear bond strength test, the test surfaces of the enamel and the resin specimens were observed using the SEM. The etching times that showed the highest bond strengths were 30 seconds both in the PCA non-thermal cycled group (80.10 +/- 13.01 MPa) and the PCA thermal cycled group (78.99 +/- 10.93 MPa), 20 seconds in the Silux non-thermal cycled group (76.77 +/- 12.99 MPa) and 60 seconds in the Silux thermal cycled group (63.61 +/- 19.64 MPa). The influence of thermal cycling test to the enamel-resin adhesion is relatively slight both in the PCA group and the Silux group.
pubmed:language
eng
pubmed:journal
pubmed:citationSubset
D
pubmed:chemical
pubmed:status
MEDLINE
pubmed:issn
1053-4628
pubmed:author
pubmed:issnType
Print
pubmed:volume
17
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
25-31
pubmed:dateRevised
2003-11-14
pubmed:meshHeading
pubmed:year
1992
pubmed:articleTitle
Resin adhesion to the ground primary enamel: influence of etching times and thermal cycling test.
pubmed:affiliation
Department of Pediatric Dentistry, Nagasaki University School of Dentistry, Japan.
pubmed:publicationType
Journal Article