Statements in which the resource exists as a subject.
PredicateObject
rdf:type
lifeskim:mentions
pubmed:issue
5-6
pubmed:dateCreated
1993-11-4
pubmed:abstractText
The ESEM is ideally suited to study soldering processes. We have used it to observe solder reflow and joining in ambient gases. It reproduces effects of atmospheric pressure reflow in a hot stage light microscope, but with much better clarity and depth of field. Compared to a regular SEM, the ESEM offers advantages of atmosphere control and ability to observe the solder samples without carbon or gold coating. These coatings could interfere with the oxidation/reduction reactions which occur at the solder/ambient gas interface. Very thin surface films, especially oxide layers, dramatically influence the flow of liquid solder and the ability of solder to wet or join to another surface. Fluxless processes in particular are ideally suited for study in the ESEM. We have used the ESEM to observe dynamic fluxless soldering and have recorded events on videotape for later stop-action still pictures and slow motion photography. Examples of these processes are shown to illustrate the ESEM capability. Included are solder deformation structure, balling reflow of eutectic solder in hydrogen, balling reflow of eutectic solder in nitrogen, joining of two solder disks in nitrogen, and dynamic melting and freezing of an off-eutectic dendritic alloy. All of these are observed in the absence of flux.
pubmed:language
eng
pubmed:journal
pubmed:citationSubset
IM
pubmed:chemical
pubmed:status
MEDLINE
pubmed:month
Aug
pubmed:issn
1059-910X
pubmed:author
pubmed:issnType
Print
pubmed:volume
25
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
493-502
pubmed:dateRevised
2000-12-18
pubmed:meshHeading
pubmed:year
1993
pubmed:articleTitle
Application of ESEM to fluxless soldering.
pubmed:affiliation
MCNC Center for Microelectronics Systems Technologies, Research Triangle Park, North Carolina 27709.
pubmed:publicationType
Journal Article