Linked Life Data

21204583

Source:http://linkedlifedata.com/resource/pubmed/id/21204583

Statements in which the resource exists as a subject.
PredicateObject
rdf:type
lifeskim:mentions
pubmed:issue
2
pubmed:dateCreated
2011-2-22
pubmed:abstractText
This paper demonstrates for the first time thermally induced gradual hydrophobization, monitored quantitatively by ellipsometric porosimetry, of four prototypical periodic mesoporous organosilicas (PMOs) that are tailored through materials chemistry for use as low-dielectric-constant (low k) materials in microprocessors. Theoretical aspects of this quantification are briefly discussed. A comparison of structural, mechanical, dielectric, and hydrophobic properties of ethane, methane, ethene, and 3-ring PMOs is made. Particularly, ethane, methane, and 3-ring PMOs show impressive water repellency at post-treatment temperatures as low as 350 °C, with corresponding Young's modulus values greater than 10 GPa and k values smaller than 2, a figure of merit that satisfies the technological requirements of future generation microchips.
pubmed:language
eng
pubmed:journal
pubmed:status
PubMed-not-MEDLINE
pubmed:month
Feb
pubmed:issn
1936-086X
pubmed:author
pubmed:issnType
Electronic
pubmed:day
22
pubmed:volume
5
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
1267-75
pubmed:year
2011
pubmed:articleTitle
Water repellent periodic mesoporous organosilicas.
pubmed:affiliation
Materials Chemistry Research Group, Department of Chemistry, University of Toronto, 80 St. George Street, Toronto, M5S 3H6, Canada.
pubmed:publicationType
Journal Article, Research Support, Non-U.S. Gov't