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rdf:type
lifeskim:mentions
pubmed:issue
14
pubmed:dateCreated
2010-7-16
pubmed:abstractText
We have conducted experimental investigations for the micromachining of dielectrics (fused silica) using an integrated femtosecond (fs) and nanosecond (ns) dual-beam laser system at different time delays between the fs and ns pulses. We found that the maximum ablation enhancement occurs when the fs pulse is shot near the peak of the ns pulse envelope. Enhancements up to 13.4 times in ablation depth and 50.7 times in the amount of material removal were obtained, as compared to fs laser ablation alone. The fs pulse increases the free electron density and changes the optical properties of fused silica to have metallic characteristics, which increases the absorption of the ns laser energy. This study provides an opportunity for efficient micromachining of dielectrics.
pubmed:language
eng
pubmed:journal
pubmed:status
PubMed-not-MEDLINE
pubmed:month
Jul
pubmed:issn
1539-4794
pubmed:author
pubmed:issnType
Electronic
pubmed:day
15
pubmed:volume
35
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
2490-2
pubmed:year
2010
pubmed:articleTitle
Investigations of femtosecond-nanosecond dual-beam laser ablation of dielectrics.
pubmed:affiliation
Department of Engineering Science, National Cheng Kung University, Tainan 701, Taiwan.
pubmed:publicationType
Journal Article