Source:http://linkedlifedata.com/resource/pubmed/id/20358963
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Predicate | Object |
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rdf:type | |
lifeskim:mentions | |
pubmed:issue |
5
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pubmed:dateCreated |
2010-4-2
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pubmed:abstractText |
The evolution of nano-grains in oxygen free copper with accumulative roll-bonding is investigated by TEM and EBSD analysis. The ultrafine grains developed in the sample after 8-cycle ARB. It was found that the mean spacing of grain boundaries, which was 63 microm in initial material, reduced to 5.5 microm after 1 cycle, then surprisingly 450 nm after 3 cycles. In addition, the fraction of high-angle boundaries in the sample after 1-cycle ARB was 0.32, but it after 3-cycle ARB was surprisingly more than 0.6. Texture development of the ARB processed samples is different depending on the number of ARB cycles.
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pubmed:language |
eng
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pubmed:journal | |
pubmed:status |
PubMed-not-MEDLINE
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pubmed:month |
May
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pubmed:issn |
1533-4880
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pubmed:author | |
pubmed:issnType |
Print
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pubmed:volume |
10
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pubmed:owner |
NLM
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pubmed:authorsComplete |
Y
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pubmed:pagination |
3389-92
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pubmed:year |
2010
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pubmed:articleTitle |
Evolution of nano-grains in high purity copper by accumulative roll-bonding process.
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pubmed:affiliation |
Department of Advanced Materials Science and Engineering, Mokpo National University, Muan-gun 534-729, Chonnam, Korea.
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pubmed:publicationType |
Journal Article,
Research Support, Non-U.S. Gov't
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