This paper is devoted to the electroless plating of non-conductive substrates under ultrasound at 530 kHz. The ultrasonic irradiation is applied to the activation and to the plating steps. Effects are measured by following the final copper thickness obtained in 1 h of plating time, easily correlated to the average plating rate. It appears that ultrasound has a strong influence on the plating rates enhancement, and assumptions can be made that this increase could be linked to the catalyst cleaning. This is confirmed by XPS measurements.
Laboratoire de Chimie des Matériaux et des Interfaces, IUT, Département Chimie, BP 1559, 30 Avenue de l'Observatoire F-25009, Besançon Cedex, France. francis.touyeras@univ-fcomte.fr
