Statements in which the resource exists as a subject.
PredicateObject
rdf:type
lifeskim:mentions
pubmed:issue
2
pubmed:dateCreated
2002-9-4
pubmed:abstractText
To develop a thermoplastic elastomer with high blood compatibility, a 2-methacryloyloxyethyl phosphorylcholine (MPC) polymer was blended with the segmented polyurethane (SPU) for preparing the polymer alloy. A tensile strength measurement was carried out to evaluate its mechanical strength. The mechanical strength of the SPU/MPC polymer alloy is the same as that of the original SPU and sufficient for use in medical applications. The thermal properties of the polymer alloy were evaluated by differential scanning calorimetry (DSC). The DSC curves indicated that the MPC polymer blended into the SPU did not affect the hard segment domain of the SPU. The SPU/MPC polymer alloy can be processed by heat treatment at 150 degrees C. Even after heat treatment, the SPU/MPC polymer alloy showed good mechanical properties, and MPC units were observed on the surface. Protein adsorption from human plasma was observed to evaluate the blood compatibility of the polymer alloy. The SPU/MPC polymer alloy suppressed protein adsorption on the surface before and after the heat treatment. Based on these results, it is concluded that the SPU/MPC polymer alloy has an excellent potential for application in various medical devices.
pubmed:language
eng
pubmed:journal
pubmed:citationSubset
IM
pubmed:chemical
pubmed:status
MEDLINE
pubmed:month
Nov
pubmed:issn
0021-9304
pubmed:author
pubmed:copyrightInfo
Copyright 2002 Wiley Periodicals, Inc.
pubmed:issnType
Print
pubmed:volume
62
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
214-21
pubmed:dateRevised
2008-11-21
pubmed:meshHeading
pubmed:year
2002
pubmed:articleTitle
Thermal property and processability of elastomeric polymer alloy composed of segmented polyurethane and phospholipid polymer.
pubmed:affiliation
Department of Materials Engineering, School of Engineering, The University of Tokyo, 7-3-1, Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan.
pubmed:publicationType
Journal Article, Research Support, Non-U.S. Gov't