| pubmed-article:3477857 | pubmed:abstractText | Three types of amalgam, one conventional, ANA 68, and two with high copper content, Dispersalloy (dispersed type) and ANA 2000 (single composition type), were investigated. The amalgams were immersed for periods of 7 wk at a time, up to 35 wk, in 23 ml (37 degrees C) of 0.9% NaCl aqueous solutions and in 0.9% NaCl solution buffered with NaH2PO4 (8.8 mM) and Na2HPO4 (1.2 mM). The amalgam specimens were embedded in epoxy resin. The surface area of amalgam exposed to the solutions was 0.2 cm2 for each specimen. Every 7 wk the corrosion potential was measured, the amalgam specimens lightly brushed with a soft toothbrush, and the solutions renewed. After 14-21 wk and 35 wk the currents during anodic polarization sweeps over the amalgams were recorded. The corrosion potential for the high-Cu amalgams was somewhat more positive (noble) in the phosphate buffered solution than in the non-buffered solution during the 35 wk of corrosion. The phosphate buffer reduced the reactivity of the amalgams during anodic polarization. Corrosion made the amalgams more passive during the anodic polarization. However, all the elements leached from the amalgams into the solutions throughout the entire experiment. | lld:pubmed |
