| pubmed-article:21595432 | pubmed:abstractText | Waste printed circuit boards (WPCBs) are treated by crushing and electrostatic separation to obtain the copper-rich particles. However, the copper-rich particles contain a certain content of solder, which may cause Pb contamination if improperly treated. The separation behaviors of Pb from single solder and solder mixed with Cu particles under vacuum are studied in this work. Due to the presence of Cu particles in the copper-rich particles, it becomes much easier to separate Pb from mixed particles than from single solder. On the basis of the experiments, the rules and phenomena different from previous studies are concluded, including the multilayer evaporation effect, the formation of Cu-Sn intermetallic compound and so on. Mechanisms of these phenomena are also explored. Pb is separated and recovered from copper-rich particles of crushed WPCBs at 1123 K for 90 min under 0.1-1 Pa. The metals including Cu, Pb, Sn in WPCBs are all efficiently recovered. This work enriches separating rules for recovering Pb by evaporation and condensation, and also points out an efficient and promising method for recovering toxic heavy metals from WPCBs. | lld:pubmed |
