To test the hypothesis that there is a reduction in bond strength when a microtensile load is applied to adhesive junctions prepared at 10, 20 and 30 degrees to the usual perpendicular interface. To evaluate the effect of bond angle and adhesive layer thickness on stress levels within the adhesive joint utilizing FEA.
Department of Biomaterials and Biomimetics, Department of Prosthodontics, New York University, College of Dentistry, 345 East 24th Street, Room 804, New York City, NY 10010, USA.
