Linked Life Data

18376869

Source:http://linkedlifedata.com/resource/pubmed/id/18376869

Statements in which the resource exists as a subject.
PredicateObject
rdf:type
lifeskim:mentions
pubmed:issue
5
pubmed:dateCreated
2008-5-15
pubmed:abstractText
Transmission electron microscopy was used to analyze the three-dimensional (3D) architecture of cuprous oxide electrochemically deposited through the pores of the hexagonally packed intermediate surface-layer protein from Deinococcus radiodurans SARK. Imaging at multiple tilt angles and averaging from five different samples allowed approximately 3 nm computed 3D reconstructions of the inorganic deposit and protein template. We show that the electrodeposition process used here was able to fully access the pore structure that penetrates the protein layer, allowing the fabrication of a polycrystalline nanoarray with 18 nm periodicity and lateral interconnectivity among the pores with 3-fold symmetry. At the resolution of the reconstruction, the 6-fold symmetry pores also appear filled but are not connected laterally to the rest of the deposit. These results show that electrochemical deposition can produce interconnected 3D structures at dimensions an order of magnitude smaller than the most advanced integrated circuits (IC), boding well for continued down-scaling of electrodeposition to meet the needs for future generations of IC device interconnects.
pubmed:grant
pubmed:language
eng
pubmed:journal
pubmed:citationSubset
IM
pubmed:chemical
pubmed:status
MEDLINE
pubmed:month
May
pubmed:issn
1530-6984
pubmed:author
pubmed:issnType
Print
pubmed:volume
8
pubmed:owner
NLM
pubmed:authorsComplete
Y
pubmed:pagination
1434-8
pubmed:dateRevised
2011-1-26
pubmed:meshHeading
pubmed:year
2008
pubmed:articleTitle
Three-dimensional architecture of inorganic nanoarrays electrodeposited through a surface-layer protein mask.
pubmed:affiliation
Department of Chemical Engineering, University of Washington, Seattle, Washington 98195, USA.
pubmed:publicationType
Journal Article, Research Support, U.S. Gov't, Non-P.H.S., Research Support, N.I.H., Extramural